Inventor
EWER PETER R
GB15 patents
Patents
15 patentsUS6204554B1Mar 20, 2001
Surface mount semiconductor package
INT RECTIFIER CORP213 citations98
US5886397AMar 23, 1999
Crushable bead on lead finger side surface to improve moldability
INT RECTIFIER CORP198 citations98
US4965710AOct 23, 1990
Insulated gate bipolar transistor power module
INT RECTIFIER CORP120 citations96
US6476481B2Nov 5, 2002
High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
INT RECTIFIER CORP61 citations93
US6255722B1Jul 3, 2001
High current capacity semiconductor device housing
INT RECTIFIER CORP67 citations93
US6075286AJun 13, 2000
Stress clip design
INT RECTIFIER CORP40 citations92
US6667547B2Dec 23, 2003
High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
INT RECTIFIER CORP31 citations90
US6465875B2Oct 15, 2002
Semiconductor device package with plural pad lead frame
INT RECTIFIER CORP41 citations90
US4853762AAug 1, 1989
Semi-conductor modules
INT RECTIFIER CORP36 citations86
US6512304B2Jan 28, 2003
Nickel-iron expansion contact for semiconductor die
INT RECTIFIER CORP11 citations73
US6281096B1Aug 28, 2001
Chip scale packaging process
INT RECTIFIER CORP9 citations73
US6078098AJun 20, 2000
Crushable bead on lead finger side surface to improve moldability
INT RECTIFIER CORP11 citations73
US6348727B1Feb 19, 2002
High current semiconductor device package with plastic housing and conductive tab
INT RECTIFIER CORP10 citations68
US6396091B2May 28, 2002
Chip scale package
INT RECTIFIER CORP4 citations62
US5902959AMay 11, 1999
Lead frame with waffled front and rear surfaces
INT RECTIFIER CORP2 citations57