Inventor
LI CHENG-CHIEN
TW17 patents
⚠️ This page may combine multiple inventors who share the name “LI CHENG-CHIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
14 patentsUS10505001B2Dec 10, 2019
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10032873B2Jul 24, 2018
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US11749724B2Sep 5, 2023
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US9647122B2May 9, 2017
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11056392B2Jul 6, 2021
FinFET devices having gate stacks with protruding parts and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations65
US12237380B2Feb 25, 2025
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11024718B2Jun 1, 2021
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12354975B2Jul 8, 2025
Guard ring structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12288735B2Apr 29, 2025
Through via structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11049775B2Jun 29, 2021
Semiconductor device having FinFET with work function layers and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12136600B2Nov 5, 2024
Grounded metal ring structure for through-silicon via
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US10050148B2Aug 14, 2018
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9443721B2Sep 13, 2016
Wafer back side processing structure and apparatus
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12046566B2Jul 23, 2024
Devices with through silicon vias, guard rings and methods of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50