Inventor

OH CHEE-WAY

TW2 patents

⚠️ This page may combine multiple inventors who share the name “OH CHEE-WAY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG EDWARD-YI

1 patent

US8258606B2Sep 4, 2012

High frequency flip chip package structure of polymer substrate

CHANG EDWARD-YI0 citations48

UNIV NAT CHIAO TUNG

1 patent

US8033039B2Oct 11, 2011

High frequency flip chip package process of polymer substrate and structure thereof

UNIV NAT CHIAO TUNG0 citations48