Inventor
RICHARDSON THOMAS B
US15 patents
⚠️ This page may combine multiple inventors who share the name “RICHARDSON THOMAS B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ENTHONE
6 patentsUS7670950B2Mar 2, 2010
Copper metallization of through silicon via
ENTHONE43 citations92
US7713859B2May 11, 2010
Tin-silver solder bumping in electronics manufacture
ENTHONE12 citations79
US8986434B2Mar 24, 2015
Silver plating in electronics manufacture
ENTHONE2 citations60
US8349393B2Jan 8, 2013
Silver plating in electronics manufacture
ENTHONE2 citations60
US9730321B2Aug 8, 2017
Silver plating in electronics manufacture
ENTHONE0 citations49
US9657402B2May 23, 2017
Cyanide-free electrolyte composition and method for the deposition of silver or silver alloy layers on substrates
ENTHONE0 citations48
MACDERMID ENTHONE INC
6 patentsUS10519557B2Dec 31, 2019
Leveler compositions for use in copper deposition in manufacture of microelectronics
MACDERMID ENTHONE INC2 citations70
US12398480B2Aug 26, 2025
Leveler compositions for use in copper deposition in manufacture of microelectronics
MACDERMID ENTHONE INC0 citations60
US11168406B2Nov 9, 2021
Leveler compositions for use in copper deposition in manufacture of microelectronics
MACDERMID ENTHONE INC0 citations59
US11873568B2Jan 16, 2024
Compositions and methods for the electrodeposition of nanotwinned copper
MACDERMID ENTHONE INC0 citations56
US11384446B2Jul 12, 2022
Compositions and methods for the electrodeposition of nanotwinned copper
MACDERMID ENTHONE INC1 citations56
US10103029B2Oct 16, 2018
Process for filling vias in the microelectronics
MACDERMID ENTHONE INC1 citations50