Inventor

Yang ming-kun

TW3 patents

⚠️ This page may combine multiple inventors who share the name “Yang ming-kun”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YEN YU-LIN

1 patent

US9559001B2Jan 31, 2017

Chip package and method for forming the same

YEN YU-LIN5 citations70

Yang ming-kun

1 patent

US8692300B2Apr 8, 2014

Interposer and method for forming the same

Yang ming-kun0 citations42

CHEN CHIEN-HUI

1 patent

US9711403B2Jul 18, 2017

Method for forming chip package

CHEN CHIEN-HUI0 citations32