Inventor
YANG SHENG-PIN
TW12 patents
⚠️ This page may combine multiple inventors who share the name “YANG SHENG-PIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
10 patentsUS11855028B2Dec 26, 2023
Hybrid micro-bump integration with redistribution layer
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10269703B2Apr 23, 2019
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10163849B2Dec 25, 2018
Method of manufacturing semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12347722B2Jul 1, 2025
Semiconductor device structure with a protection cap at an end portion of a conductive line
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11557508B2Jan 17, 2023
Semiconductor device structure having protection caps on conductive lines
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12412857B2Sep 9, 2025
Hybrid micro-bump integration with redistribution layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11069652B2Jul 20, 2021
Method of manufacturing semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10748810B2Aug 18, 2020
Method of manufacturing an integrated inductor with protections caps on conductive lines
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10535629B2Jan 14, 2020
Method of manufacturing semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9799625B2Oct 24, 2017
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50