Inventor
JEN WEI-LUN
US8 patents
Patents
8 patentsUS11521931B2Dec 6, 2022
Microelectronic structures including bridges
INTEL CORP7 citations84
US11270959B2Mar 8, 2022
Enabling magnetic films in inductors integrated into semiconductor packages
INTEL CORP3 citations68
US12336196B2Jun 17, 2025
Magnetic core inductors on package substrates
INTEL CORP1 citations61
US11764150B2Sep 19, 2023
Inductors for package substrates
INTEL CORP0 citations60
US11769719B2Sep 26, 2023
Dual trace thickness for single layer routing
INTEL CORP0 citations59
US11923307B2Mar 5, 2024
Microelectronic structures including bridges
INTEL CORP0 citations50
US10658198B2May 19, 2020
Solder resist layer structures for terminating de-featured components and methods of making the same
INTEL CORP0 citations45
US10244632B2Mar 26, 2019
Solder resist layer structures for terminating de-featured components and methods of making the same
INTEL CORP0 citations45