Inventor
BABICH EDWARD D
US21 patents
Patents
21 patentsUS5830332ANov 3, 1998
Sputter deposition of hydrogenated amorphous carbon film and applications thereof
IBM267 citations99
US6685853B1Feb 3, 2004
Energy sensitive electrically conductive admixtures, uses thereof, methods of fabrication and structures fabricated therewith
IBM79 citations97
US6436605B1Aug 20, 2002
Plasma resistant composition and use thereof
IBM31 citations92
US6132644AOct 17, 2000
Energy sensitive electrically conductive admixtures
IBM28 citations92
US5593812AJan 14, 1997
Photoresist having increased sensitivity and use thereof
IBM18 citations92
US5059512AOct 22, 1991
Ultraviolet light sensitive photoinitiator compositions, use thereof and radiation sensitive compositions
IBM27 citations92
US6251569B1Jun 26, 2001
Forming a pattern of a negative photoresist
IBM23 citations91
US5286599AFeb 15, 1994
Base developable negative photoresist composition and use thereof
IBM23 citations91
US4782008ANov 1, 1988
Plasma-resistant polymeric material, preparation thereof, and use thereof
IBM33 citations91
US5229251AJul 20, 1993
Dry developable photoresist containing an epoxide, organosilicon and onium salt
IBM15 citations81
US5141817AAug 25, 1992
Dielectric structures having embedded gap filling RIE etch stop polymeric materials of high thermal stability
IBM18 citations81
US5115095AMay 19, 1992
Epoxy functional organosilicon polymer
IBM7 citations74
US5110711AMay 5, 1992
Method for forming a pattern
IBM9 citations74
US5098816AMar 24, 1992
Method for forming a pattern of a photoresist
IBM10 citations74
US4603195AJul 29, 1986
Organosilicon compound and use thereof in photolithography
IBM11 citations74
US5565529AOct 15, 1996
Dielectric structures having embedded gap filling RIE etch stop polymeric materials of high thermal stability
IBM11 citations73
US6617086B2Sep 9, 2003
Forming a pattern of a negative photoresist
IBM5 citations72
US5457005AOct 10, 1995
Dry developable photoresist and use thereof
IBM14 citations72
US4981909AJan 1, 1991
Plasma-resistant polymeric material, preparation thereof, and use thereof
IBM12 citations72
US4693960ASep 15, 1987
Photolithographic etching process using organosilicon polymer composition
IBM17 citations68
US5238773AAug 24, 1993
Alkaline developable photoresist composition containing radiation sensitive organosilicon compound with quinone diazide terminal groups
IBM5 citations62