Inventor
HATZAKIS MICHAEL
US29 patents
⚠️ This page may combine multiple inventors who share the name “HATZAKIS MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
28 patentsUS6097019AAug 1, 2000
Radiation control system
IBM58 citations96
US5041358AAug 20, 1991
Negative photoresist and use thereof
IBM58 citations96
US5171992ADec 15, 1992
Nanometer scale probe for an atomic force microscope, and method for making same
IBM119 citations95
US4142107AFeb 27, 1979
Resist development control system
IBM87 citations95
US4212935AJul 15, 1980
Method of modifying the development profile of photoresists
IBM99 citations94
US5059512AOct 22, 1991
Ultraviolet light sensitive photoinitiator compositions, use thereof and radiation sensitive compositions
IBM27 citations92
US4156745AMay 29, 1979
Electron sensitive resist and a method preparing the same
IBM37 citations92
US4782008ANov 1, 1988
Plasma-resistant polymeric material, preparation thereof, and use thereof
IBM33 citations91
US3984582AOct 5, 1976
Method for preparing positive resist image
IBM38 citations91
US4086870AMay 2, 1978
Novel resist spinning head
IBM72 citations88
US4581100AApr 8, 1986
Mixed excitation plasma etching system
IBM40 citations87
US4087569AMay 2, 1978
Prebaking treatment for resist mask composition and mask making process using same
IBM20 citations82
US4035522AJul 12, 1977
X-ray lithography mask
IBM31 citations82
US4024293AMay 17, 1977
High sensitivity resist system for lift-off metallization
IBM30 citations82
US5141817AAug 25, 1992
Dielectric structures having embedded gap filling RIE etch stop polymeric materials of high thermal stability
IBM18 citations81
US3957552AMay 18, 1976
Method for making multilayer devices using only a single critical masking step
IBM23 citations81
US4379833AApr 12, 1983
Self-aligned photoresist process
IBM25 citations80
US5115095AMay 19, 1992
Epoxy functional organosilicon polymer
IBM7 citations74
US5110711AMay 5, 1992
Method for forming a pattern
IBM9 citations74
US5098816AMar 24, 1992
Method for forming a pattern of a photoresist
IBM10 citations74
US4603195AJul 29, 1986
Organosilicon compound and use thereof in photolithography
IBM11 citations74
US5565529AOct 15, 1996
Dielectric structures having embedded gap filling RIE etch stop polymeric materials of high thermal stability
IBM11 citations73
US4001061AJan 4, 1977
Single lithography for multiple-layer bubble domain devices
IBM9 citations73
US4981909AJan 1, 1991
Plasma-resistant polymeric material, preparation thereof, and use thereof
IBM12 citations72
US4259369AMar 31, 1981
Image hardening process
IBM8 citations71
US4693960ASep 15, 1987
Photolithographic etching process using organosilicon polymer composition
IBM17 citations68
US5238773AAug 24, 1993
Alkaline developable photoresist composition containing radiation sensitive organosilicon compound with quinone diazide terminal groups
IBM5 citations62
US4678850AJul 7, 1987
Halogenated polystyrenes for electron beam, X-ray and photo resists
IBM3 citations57