Inventor
KELLER DAVID J
US45 patents
⚠️ This page may combine multiple inventors who share the name “KELLER DAVID J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
31 patentsUS5652170AJul 29, 1997
Method for etching sloped contact openings in polysilicon
MICRON TECHNOLOGY INC33 citations96
US5644153AJul 1, 1997
Method for etching nitride features in integrated circuit construction
MICRON TECHNOLOGY INC56 citations96
US6552394B2Apr 22, 2003
Semiconductor transistor devices and structures with halo regions
MICRON TECHNOLOGY INC15 citations93
US6165827ADec 26, 2000
Semiconductor transistor devices and methods for forming semiconductor transistor devices
MICRON TECHNOLOGY INC20 citations93
US5968844AOct 19, 1999
Method for etching nitride features in integrated circuit construction
MICRON TECHNOLOGY INC34 citations93
US5811329ASep 22, 1998
Method of forming CMOS circuitry including patterning a layer of conductive material overlying field isolation oxide
MICRON TECHNOLOGY INC20 citations93
US5651856AJul 29, 1997
Selective etch process
MICRON TECHNOLOGY INC25 citations93
US5620615AApr 15, 1997
Method of etching or removing W and WSix films
MICRON TECHNOLOGY INC32 citations93
US6432765B1Aug 13, 2002
Funnel shaped structure in polysilicon and method of making
MICRON TECHNOLOGY INC18 citations92
US6010930AJan 4, 2000
Vertically oriented structure with sloped opening and method for etching
MICRON TECHNOLOGY INC21 citations92
US6346439B1Feb 12, 2002
Semiconductor transistor devices and methods for forming semiconductor transistor devices
MICRON TECHNOLOGY INC12 citations82
US6069087AMay 30, 2000
Highly selective dry etching process
MICRON TECHNOLOGY INC17 citations82
US5923977AJul 13, 1999
Method of forming CMOS circuitry including patterning a layer of conductive material overlying field isolation oxide
MICRON TECHNOLOGY INC16 citations82
US5906950AMay 25, 1999
Selective etch process
MICRON TECHNOLOGY INC16 citations82
US6875559B2Apr 5, 2005
Method of etching materials patterned with a single layer 193nm resist
MICRON TECHNOLOGY INC6 citations74
US6333539B1Dec 25, 2001
Semiconductor transistor devices and methods for forming semiconductor transistor devices
MICRON TECHNOLOGY INC7 citations74
US6319779B1Nov 20, 2001
Semiconductor transistor devices and methods for forming semiconductor transistor devices
MICRON TECHNOLOGY INC10 citations74
US6136637AOct 24, 2000
Method of forming CMOS circuitry including patterning conductive material overlying field isolation oxide
MICRON TECHNOLOGY INC5 citations74
US5756216AMay 26, 1998
Highly selective nitride spacer etch
MICRON TECHNOLOGY INC15 citations74
US5700580ADec 23, 1997
Highly selective nitride spacer etch
MICRON TECHNOLOGY INC11 citations74
US6018173AJan 25, 2000
Vertically oriented capacitor structure with sloped contact opening and method for etching sloped contact openings in polysilicon
MICRON TECHNOLOGY INC8 citations73
US7898019B2Mar 1, 2011
Semiconductor constructions having multiple patterned masking layers over NAND gate stacks
MICRON TECHNOLOGY INC3 citations63
US7476588B2Jan 13, 2009
Methods of forming NAND cell units with string gates of various widths
MICRON TECHNOLOGY INC3 citations63
US7410748B2Aug 12, 2008
Method of etching materials patterned with a single layer 193nm resist
MICRON TECHNOLOGY INC2 citations63
US7341951B2Mar 11, 2008
Methods of forming semiconductor constructions
MICRON TECHNOLOGY INC2 citations63
US6722376B2Apr 20, 2004
Polysilicon etch useful during the manufacture of a semiconductor device
MICRON TECHNOLOGY INC2 citations63
US8367303B2Feb 5, 2013
Semiconductor device fabrication and dry develop process suitable for critical dimension tunability and profile control
MICRON TECHNOLOGY INC2 citations62
US6545308B2Apr 8, 2003
Funnel shaped structure in polysilicon
MICRON TECHNOLOGY INC3 citations62
US8043911B2Oct 25, 2011
Methods of forming semiconductor constructions
MICRON TECHNOLOGY INC0 citations52
US7163017B2Jan 16, 2007
Polysilicon etch useful during the manufacture of a semiconductor device
MICRON TECHNOLOGY INC0 citations52
US9082721B2Jul 14, 2015
Structures comprising masks comprising carbon
MICRON TECHNOLOGY INC1 citations51
BORDEN INC
8 patentsUS4515769AMay 7, 1985
Encapsulated flavorant material, method for its preparation, and food and other compositions incorporating same
BORDEN INC248 citations97
US4386106AMay 31, 1983
Process for preparing a time delayed release flavorant and an improved flavored chewing gum composition
BORDEN INC230 citations97
US4888194ADec 19, 1989
Shelf-stable aseptic dairy product
BORDEN INC48 citations90
US4851243AJul 25, 1989
Calcium fortified aseptically packaged milk
BORDEN INC49 citations90
US4748028AMay 31, 1988
Aseptic fluid coffee whitener and process for preparing same
BORDEN INC42 citations90
US4935255AJun 19, 1990
Controlled headspace gas packaging of aseptic dairy products while maintaining fat emulsion stability
BORDEN INC36 citations88
US5021251AJun 4, 1991
Process for preserving lemon juice utilizating a non-sulfite preservative
BORDEN INC41 citations87
US5128156AJul 7, 1992
Process for preparing an alternate protein source for coffee whiteners and other products
BORDEN INC20 citations79
MICRON SEMICONDUCTOR INC
5 patentsUS5346586ASep 13, 1994
Method for selectively etching polysilicon to gate oxide using an insitu ozone photoresist strip
MICRON SEMICONDUCTOR INC80 citations96
US5256245AOct 26, 1993
Use of a clean up step to form more vertical profiles of polycrystalline silicon sidewalls during the manufacture of a semiconductor device
MICRON SEMICONDUCTOR INC55 citations96
US5492597AFeb 20, 1996
Method of etching WSix films
MICRON SEMICONDUCTOR INC30 citations93
US5387312AFeb 7, 1995
High selective nitride etch
MICRON SEMICONDUCTOR INC22 citations90
US5338395AAug 16, 1994
Method for enhancing etch uniformity useful in etching submicron nitride features
MICRON SEMICONDUCTOR INC16 citations71