P

Inventor

OH JAE-SUNG

KR7 patents
⚠️ This page may combine multiple inventors who share the name “OH JAE-SUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SK HYNIX INC

3 patents
US8823158B2Sep 2, 2014

Semiconductor package and stacked semiconductor package having the same

SK HYNIX INC27 citations90
US9030009B2May 12, 2015

Stacked semiconductor package and method for manufacturing the same

SK HYNIX INC4 citations68
US9070691B2Jun 30, 2015

Semiconductor package and stacked semiconductor package having the same

SK HYNIX INC2 citations60

HYNIX SEMICONDUCTOR INC

2 patents
US8024857B2Sep 27, 2011

Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the same

HYNIX SEMICONDUCTOR INC3 citations54
US7732903B2Jun 8, 2010

High capacity memory module using flexible substrate

HYNIX SEMICONDUCTOR INC0 citations39

SAMSUNG ELECTRONICS CO LTD

1 patent
US6032255AFeb 29, 2000

Method for booting a personal digital assistant

SAMSUNG ELECTRONICS CO LTD47 citations89

OH JAE SUNG

1 patent
US8299591B2Oct 30, 2012

Semiconductor package and stacked semiconductor package having the same

OH JAE SUNG10 citations77