Inventor
KOMORITA HIROSHI
JP19 patents
⚠️ This page may combine multiple inventors who share the name “KOMORITA HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
18 patentsUS6426154B1Jul 30, 2002
Ceramic circuit board
TOSHIBA KK54 citations96
US5672848ASep 30, 1997
Ceramic circuit board
TOSHIBA KK68 citations96
US5328751AJul 12, 1994
Ceramic circuit board with a curved lead terminal
TOSHIBA KK61 citations96
US6232657B1May 15, 2001
Silicon nitride circuit board and semiconductor module
TOSHIBA KK50 citations92
US6040039AMar 21, 2000
Silicon nitride circuit board
TOSHIBA KK27 citations92
US5998000ADec 7, 1999
Silicon nitride circuit board
TOSHIBA KK23 citations92
US5928768AJul 27, 1999
Silicon nitride circuit board
TOSHIBA KK32 citations92
US5280850AJan 25, 1994
Method of manufacturing circuit board
TOSHIBA KK24 citations92
US5176309AJan 5, 1993
Method of manufacturing circuit board
TOSHIBA KK31 citations92
US4987677AJan 29, 1991
Bonded ceramic metal composite substrate, circuit board constructed therewith and methods for production thereof
TOSHIBA KK22 citations92
US6605868B2Aug 12, 2003
Insulating substrate including multilevel insulative ceramic layers joined with an intermediate layer
TOSHIBA KK20 citations89
US6784131B2Aug 31, 2004
Silicon nitride wear resistant member and method of manufacturing the member
TOSHIBA KK17 citations82
US4959507ASep 25, 1990
Bonded ceramic metal composite substrate, circuit board constructed therewith and methods for production thereof
TOSHIBA KK20 citations81
US5363278ANov 8, 1994
Bonded ceramic-metal composite substrate, circuit board constructed therewith and methods for production thereof
TOSHIBA KK11 citations74
US5155665AOct 13, 1992
Bonded ceramic-metal composite substrate, circuit board constructed therewith and methods for production thereof
TOSHIBA KK11 citations74
US4954386ASep 4, 1990
Joined ceramic-metal composite substrate and method for production thereof
TOSHIBA KK14 citations73
US7263766B2Sep 4, 2007
Insulating substrate, manufacturing method thereof, and module semiconductor device with insulating substrate
TOSHIBA KK6 citations71
US6485830B1Nov 26, 2002
Material for ceramic ball and method of manufacturing ceramic ball
TOSHIBA KK5 citations60