Inventor
KASEM Y MOHAMMED
US20 patents
⚠️ This page may combine multiple inventors who share the name “KASEM Y MOHAMMED”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
VISHAY INTERTECHNOLOGY INC
9 patentsUS6562647B2May 13, 2003
Chip scale surface mount package for semiconductor device and process of fabricating the same
VISHAY INTERTECHNOLOGY INC130 citations99
US6316287B1Nov 13, 2001
Chip scale surface mount packages for semiconductor device and process of fabricating the same
VISHAY INTERTECHNOLOGY INC90 citations98
US6538300B1Mar 25, 2003
Precision high-frequency capacitor formed on semiconductor substrate
VISHAY INTERTECHNOLOGY INC39 citations96
US6271060B1Aug 7, 2001
Process of fabricating a chip scale surface mount package for semiconductor device
VISHAY INTERTECHNOLOGY INC74 citations96
US6876061B2Apr 5, 2005
Chip scale surface mount package for semiconductor device and process of fabricating the same
VISHAY INTERTECHNOLOGY INC37 citations92
US6441475B2Aug 27, 2002
Chip scale surface mount package for semiconductor device and process of fabricating the same
VISHAY INTERTECHNOLOGY INC26 citations92
US6621143B2Sep 16, 2003
Precision high-frequency capacitor on semiconductor substrate
VISHAY INTERTECHNOLOGY INC12 citations73
US6621142B2Sep 16, 2003
Precision high-frequency capacitor formed on semiconductor substrate
VISHAY INTERTECHNOLOGY INC12 citations73
US8004063B2Aug 23, 2011
Precision high-frequency capacitor formed on semiconductor substrate
VISHAY INTERTECHNOLOGY INC6 citations71
SILICONIX INC
5 patentsUS6392290B1May 21, 2002
Vertical structure for semiconductor wafer-level chip scale packages
SILICONIX INC171 citations97
US6249041B1Jun 19, 2001
IC chip package with directly connected leads
SILICONIX INC196 citations97
US6744124B1Jun 1, 2004
Semiconductor die package including cup-shaped leadframe
SILICONIX INC75 citations96
US6066890AMay 23, 2000
Separate circuit devices in an intra-package configuration and assembly techniques
SILICONIX INC53 citations92
US6909170B2Jun 21, 2005
Semiconductor assembly with package using cup-shaped lead-frame
SILICONIX INC6 citations72
VISHAY SILICONIX
4 patentsUS7211877B1May 1, 2007
Chip scale surface mount package for semiconductor device and process of fabricating the same
VISHAY SILICONIX19 citations92
US7151036B1Dec 19, 2006
Precision high-frequency capacitor formed on semiconductor substrate
VISHAY SILICONIX15 citations92
US7589396B2Sep 15, 2009
Chip scale surface mount package for semiconductor device and process of fabricating the same
VISHAY SILICONIX4 citations63
US7595547B1Sep 29, 2009
Semiconductor die package including cup-shaped leadframe
VISHAY SILICONIX0 citations51