Inventor
OSANAI HIDEYO
JP35 patents
⚠️ This page may combine multiple inventors who share the name “OSANAI HIDEYO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DOWA MINING CO
18 patentsUS7348493B2Mar 25, 2008
Metal-ceramic circuit board
DOWA MINING CO27 citations91
US7256353B2Aug 14, 2007
Metal/ceramic bonding substrate and method for producing same
DOWA MINING CO23 citations91
US6938333B2Sep 6, 2005
Method of manufacturing a metal-ceramic circuit board
DOWA MINING CO16 citations91
US6912130B2Jun 28, 2005
Combined member of aluminum-ceramics
DOWA MINING CO46 citations91
US7255931B2Aug 14, 2007
Aluminum/ceramic bonding substrate and method for producing same
DOWA MINING CO12 citations82
US7159310B2Jan 9, 2007
Electronic part mounting substrate and method for producing same
DOWA MINING CO6 citations74
US7122243B2Oct 17, 2006
Metal/ceramic bonding substrate and method for producing same
DOWA MINING CO7 citations74
US7073703B2Jul 11, 2006
Aluminum/ceramic bonding substrate and method for producing same
DOWA MINING CO8 citations74
US7131483B2Nov 7, 2006
Apparatus, mold, and method for manufacturing metal-ceramic composite member
DOWA MINING CO9 citations71
US7368665B2May 6, 2008
Circuit board and a power module employing the same
DOWA MINING CO2 citations63
US7304378B2Dec 4, 2007
Aluminum/ceramic bonding substrate
DOWA MINING CO2 citations63
US7189449B2Mar 13, 2007
Metal/ceramic bonding substrate and method for producing same
DOWA MINING CO6 citations63
US7008549B2Mar 7, 2006
Circuit board, process for producing the same and a power module employing the same
DOWA MINING CO2 citations63
US7393596B2Jul 1, 2008
Aluminum/ceramic bonding substrate and method for producing same
DOWA MINING CO2 citations60
US7387741B2Jun 17, 2008
Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof
DOWA MINING CO2 citations60
US7340828B2Mar 11, 2008
Method for producing metal/ceramic bonding circuit board
DOWA MINING CO1 citations52
US7276292B2Oct 2, 2007
Insulating substrate boards for semiconductor and power modules
DOWA MINING CO1 citations51
US6997233B2Feb 14, 2006
Mold and method for manufacturing metal-ceramic composite member
DOWA MINING CO0 citations39
DOWA METALTECH CO LTD
12 patentsUS9944565B2Apr 17, 2018
Metal/ceramic bonding substrate and method for producing same
DOWA METALTECH CO LTD6 citations79
US9831157B2Nov 28, 2017
Method of attaching an electronic part to a copper plate having a surface roughness
DOWA METALTECH CO LTD2 citations71
US10619948B2Apr 14, 2020
Heat radiating plate with supporting members and protrusion members
DOWA METALTECH CO LTD4 citations70
US12300512B2May 13, 2025
Metal/ceramic bonding substrate and method for producing same
DOWA METALTECH CO LTD0 citations62
US12145352B2Nov 19, 2024
Metal/ceramic bonding substrate and method for producing same
DOWA METALTECH CO LTD0 citations62
US11919288B2Mar 5, 2024
Method for producing heat radiation member
DOWA METALTECH CO LTD0 citations62
US7487585B2Feb 10, 2009
Method of manufacturing a metal-ceramic circuit board
DOWA METALTECH CO LTD2 citations61
US8011416B2Sep 6, 2011
Apparatus, mold, and method for manufacturing metal-ceramic composite member
DOWA METALTECH CO LTD3 citations60
US11162745B2Nov 2, 2021
Heat radiating plate and method for producing same
DOWA METALTECH CO LTD0 citations59
US12221389B2Feb 11, 2025
Aluminum/ceramic bonding substrate and method for producing same
DOWA METALTECH CO LTD0 citations57
US8039757B2Oct 18, 2011
Electronic part mounting substrate and method for producing same
DOWA METALTECH CO LTD0 citations52
US10510557B2Dec 17, 2019
Electronic part mounting substrate and method for producing same
DOWA METALTECH CO LTD0 citations40