Inventor

LOW YIP SENG

CA9 patents

⚠️ This page may combine multiple inventors who share the name “LOW YIP SENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOPACIO RODEN R

2 patents

US9576923B2Feb 21, 2017

Semiconductor chip with patterned underbump metallization and polymer film

TOPACIO RODEN R2 citations70

US8294266B2Oct 23, 2012

Conductor bump method and apparatus

TOPACIO RODEN R0 citations50

LEUNG ANDREW K W

2 patents

US9793199B2Oct 17, 2017

Circuit board with via trace connection and method of making the same

LEUNG ANDREW K W3 citations69

US8772083B2Jul 8, 2014

Solder mask with anchor structures

LEUNG ANDREW K W2 citations57

LEUNG ANDREW

1 patent

US8298945B2Oct 30, 2012

Method of manufacturing substrates having asymmetric buildup layers

LEUNG ANDREW9 citations81

ATI TECHNOLOGIES ULC

1 patent

US11335659B2May 17, 2022

Semiconductor chip with patterned underbump metallization and polymer film

ATI TECHNOLOGIES ULC2 citations71

MARTINEZ LIANE

1 patent

US8637983B2Jan 28, 2014

Face-to-face (F2F) hybrid structure for an integrated circuit

MARTINEZ LIANE6 citations68

ADVANCED MICRO DEVICES INC

1 patent

US7906424B2Mar 15, 2011

Conductor bump method and apparatus

ADVANCED MICRO DEVICES INC3 citations61

MCLELLAN NEIL R

1 patent

US8564122B2Oct 22, 2013

Circuit board component shim structure

MCLELLAN NEIL R0 citations48