Inventor
SARODE VISHWANATH YOGANANDA
IN23 patents
Patents
23 patentsUS10600623B2Mar 24, 2020
Process kit with adjustable tuning ring for edge uniformity control
APPLIED MATERIALS INC13 citations93
US11393710B2Jul 19, 2022
Wafer edge ring lifting solution
APPLIED MATERIALS INC9 citations85
US10790123B2Sep 29, 2020
Process kit with adjustable tuning ring for edge uniformity control
APPLIED MATERIALS INC11 citations85
US9761416B2Sep 12, 2017
Apparatus and methods for reducing particles in semiconductor process chambers
APPLIED MATERIALS INC7 citations84
US12002703B2Jun 4, 2024
Lift pin assembly
APPLIED MATERIALS INC2 citations73
US11004722B2May 11, 2021
Lift pin assembly
APPLIED MATERIALS INC4 citations73
US10211033B2Feb 19, 2019
Inline DPS chamber hardware are design to enable axis symmetry for improved flow conductance and uniformity
APPLIED MATERIALS INC2 citations73
US11728143B2Aug 15, 2023
Process kit with adjustable tuning ring for edge uniformity control
APPLIED MATERIALS INC2 citations72
US11201037B2Dec 14, 2021
Process kit with adjustable tuning ring for edge uniformity control
APPLIED MATERIALS INC1 citations72
US11075105B2Jul 27, 2021
In-situ apparatus for semiconductor process module
APPLIED MATERIALS INC2 citations72
US10381200B2Aug 13, 2019
Plasma chamber with tandem processing regions
APPLIED MATERIALS INC3 citations72
US11569114B2Jan 31, 2023
Semiconductor processing with cooled electrostatic chuck
APPLIED MATERIALS INC2 citations71
US11373893B2Jun 28, 2022
Cryogenic electrostatic chuck
APPLIED MATERIALS INC3 citations69
US12459071B2Nov 4, 2025
Cooling base for a substrate support
APPLIED MATERIALS INC0 citations62
US12444644B2Oct 14, 2025
Lift pin assembly
APPLIED MATERIALS INC0 citations62
US12094752B2Sep 17, 2024
Wafer edge ring lifting solution
APPLIED MATERIALS INC1 citations62
US11887879B2Jan 30, 2024
In-situ apparatus for semiconductor process module
APPLIED MATERIALS INC0 citations62
US10446418B2Oct 15, 2019
Symmetric chamber body design architecture to address variable process volume with improved flow uniformity/gas conductance
APPLIED MATERIALS INC1 citations62
US11437261B2Sep 6, 2022
Cryogenic electrostatic chuck
APPLIED MATERIALS INC0 citations59
US10727096B2Jul 28, 2020
Symmetric chamber body design architecture to address variable process volume with improved flow uniformity/gas conductance
APPLIED MATERIALS INC0 citations52
US10847351B2Nov 24, 2020
Plasma chamber with tandem processing regions
APPLIED MATERIALS INC0 citations51
US12165905B2Dec 10, 2024
Process kit enclosure system
APPLIED MATERIALS INC0 citations50
US10770269B2Sep 8, 2020
Apparatus and methods for reducing particles in semiconductor process chambers
APPLIED MATERIALS INC0 citations50