Inventor
LIU HSING-CHIH
TW21 patents
Patents
21 patentsUS11710688B2Jul 25, 2023
Semiconductor package structure
MEDIATEK INC6 citations85
US11227846B2Jan 18, 2022
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
MEDIATEK INC7 citations84
US10847869B2Nov 24, 2020
Semiconductor package having discrete antenna device
MEDIATEK INC9 citations82
US12095142B2Sep 17, 2024
Semiconductor package having discrete antenna device
MEDIATEK INC2 citations71
US11302657B2Apr 12, 2022
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
MEDIATEK INC1 citations71
US12230560B2Feb 18, 2025
Semiconductor package structure
MEDIATEK INC0 citations62
US12165961B2Dec 10, 2024
Semiconductor package structure
MEDIATEK INC0 citations62
US11908759B2Feb 20, 2024
Semiconductor device
MEDIATEK INC0 citations62
US11908767B2Feb 20, 2024
Semiconductor package structure
MEDIATEK INC0 citations62
US9129962B1Sep 8, 2015
Bonding pad arrangment design for multi-die semiconductor package structure
MEDIATEK INC3 citations62
US11967570B2Apr 23, 2024
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
MEDIATEK INC0 citations61
US11776899B2Oct 3, 2023
Via array design for multi-layer redistribution circuit structure
MEDIATEK INC0 citations61
US11705413B2Jul 18, 2023
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
MEDIATEK INC0 citations61
US10910323B2Feb 2, 2021
Semiconductor package with reduced noise
MEDIATEK INC0 citations61
US11721882B2Aug 8, 2023
Semiconductor package having discrete antenna device
MEDIATEK INC0 citations60
US11509038B2Nov 22, 2022
Semiconductor package having discrete antenna device
MEDIATEK INC0 citations60
US12300679B2May 13, 2025
Semiconductor package structure
MEDIATEK INC1 citations59
US11244913B2Feb 8, 2022
Semiconductor package
MEDIATEK INC0 citations51
US9991227B2Jun 5, 2018
Bonding pad arrangement design for multi-die semiconductor package structure
MEDIATEK INC0 citations51
US9564395B2Feb 7, 2017
Bonding pad arrangment design for multi-die semiconductor package structure
MEDIATEK INC0 citations51
US10074628B2Sep 11, 2018
System-in-package and fabrication method thereof
MEDIATEK INC0 citations41