Inventor
REN HUILIN
US14 patents
⚠️ This page may combine multiple inventors who share the name “REN HUILIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMPHENOL CORP
8 patentsUS11057995B2Jul 6, 2021
Backplane footprint for high speed, high density electrical connectors
AMPHENOL CORP14 citations94
US7242592B2Jul 10, 2007
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics
AMPHENOL CORP20 citations91
US11758656B2Sep 12, 2023
Backplane footprint for high speed, high density electrical connectors
AMPHENOL CORP4 citations75
US9825391B2Nov 21, 2017
Method of forming an electrical connector
AMPHENOL CORP3 citations73
US7508681B2Mar 24, 2009
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics
AMPHENOL CORP7 citations72
US12171063B2Dec 17, 2024
Backplane footprint for high speed, high density electrical connectors
AMPHENOL CORP0 citations62
US11901660B2Feb 13, 2024
High speed, high density electrical connector
AMPHENOL CORP0 citations62
US10958007B2Mar 23, 2021
High speed, high density electrical connector
AMPHENOL CORP0 citations62
TERADYNE INC
3 patentsUS6776659B1Aug 17, 2004
High speed, high density electrical connector
TERADYNE INC264 citations98
US6814619B1Nov 9, 2004
High speed, high density electrical connector and connector assembly
TERADYNE INC177 citations96
US6780059B1Aug 24, 2004
High speed, high density electrical connector
TERADYNE INC53 citations92