P

Inventor

KIM JIHWANG

KR16 patents

Patents

16 patents
US12388029B2Aug 12, 2025

Semiconductor package

SAMSUNG ELECTRONICS CO LTD3 citations74
US11367688B2Jun 21, 2022

Semiconductor package with interposer

SAMSUNG ELECTRONICS CO LTD2 citations72
US12334454B2Jun 17, 2025

Semiconductor package including molding layer

SAMSUNG ELECTRONICS CO LTD0 citations62
US12261157B2Mar 25, 2025

Semiconductor device having package on package structure and method of manufacturing the semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations62
US11817401B2Nov 14, 2023

Semiconductor package including molding layer

SAMSUNG ELECTRONICS CO LTD0 citations62
US11804477B2Oct 31, 2023

Semiconductor device having package on package structure and method of manufacturing the semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations62
US11798889B2Oct 24, 2023

Methods of manufacturing semiconductor packages

SAMSUNG ELECTRONICS CO LTD0 citations62
US12148729B2Nov 19, 2024

Semiconductor package structure having interposer substrate, and stacked semiconductor package structure including the same

SAMSUNG ELECTRONICS CO LTD0 citations61
US12021036B2Jun 25, 2024

Semiconductor package including interposer and method of manufacturing the semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations61
US11521934B2Dec 6, 2022

Semiconductor package including interposer and method of manufacturing the semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations61
US11710673B2Jul 25, 2023

Interposer and semiconductor package including the same

SAMSUNG ELECTRONICS CO LTD0 citations50
US12519048B2Jan 6, 2026

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations48
US11581263B2Feb 14, 2023

Semiconductor package, and package on package having the same

SAMSUNG ELECTRONICS CO LTD0 citations48
US11404382B2Aug 2, 2022

Semiconductor package including an embedded semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations47
US12575413B2Mar 10, 2026

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations44
US11676949B2Jun 13, 2023

Semiconductor packages having supporting members

SAMSUNG ELECTRONICS CO LTD0 citations44