Inventor
DUFFY THOMAS PATRICK
US11 patents
⚠️ This page may combine multiple inventors who share the name “DUFFY THOMAS PATRICK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
8 patentsUS5876842AMar 2, 1999
Modular circuit package having vertically aligned power and signal cores
IBM85 citations96
US5798909AAug 25, 1998
Single-tiered organic chip carriers for wire bond-type chips
IBM74 citations94
US5724232AMar 3, 1998
Chip carrier having an organic photopatternable material and a metal substrate
IBM39 citations94
US5460921AOct 24, 1995
High density pattern template: materials and processes for the application of conductive pastes
IBM44 citations94
US6038137AMar 14, 2000
Chip carrier having a chip mounted on an organic dielectric substrate overlaid with a photoimageable dielectric having circuitry thereon
IBM21 citations91
US5707893AJan 13, 1998
Method of making a circuitized substrate using two different metallization processes
IBM26 citations91
US5789121AAug 4, 1998
High density template: materials and processes for the application of conductive pastes
IBM28 citations90
US5817405AOct 6, 1998
Circuitized substrate with same surface conductors of different resolutions
IBM25 citations89