Inventor
DIAS RAJEN C
US6 patents
Patents
6 patentsUS6815831B2Nov 9, 2004
Flip-chip device with multi-layered underfill having graded coefficient of thermal expansion
INTEL CORP15 citations81
US7042729B2May 9, 2006
Thermal interface apparatus, systems, and fabrication methods
INTEL CORP13 citations80
US6861285B2Mar 1, 2005
Flip chip underfill process
INTEL CORP8 citations70
US9859248B2Jan 2, 2018
Laser die backside film removal for integrated circuit (IC) packaging
INTEL CORP2 citations68
US7317258B2Jan 8, 2008
Thermal interface apparatus, systems, and fabrication methods
INTEL CORP2 citations59
US9412702B2Aug 9, 2016
Laser die backside film removal for integrated circuit (IC) packaging
INTEL CORP2 citations58