Inventor
HU YEN-CHANG
TW18 patents
⚠️ This page may combine multiple inventors who share the name “HU YEN-CHANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
8 patentsUS10157884B2Dec 18, 2018
3D die stacking structure with fine pitches
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9799620B2Oct 24, 2017
Warpage reduction and adhesion improvement of semiconductor die package
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9735087B2Aug 15, 2017
Wafer level embedded heat spreader
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US11133274B2Sep 28, 2021
Fan-out interconnect structure and method for forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11101192B2Aug 24, 2021
Wafer level embedded heat spreader
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10700025B2Jun 30, 2020
Fan-out interconnect structure and method for forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10177073B2Jan 8, 2019
Wafer level embedded heat spreader
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9418969B2Aug 16, 2016
Packaged semiconductor devices and packaging methods
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
TAIWAN SEMICONDUCTOR MFG
5 patentsUS9368460B2Jun 14, 2016
Fan-out interconnect structure and method for forming same
TAIWAN SEMICONDUCTOR MFG1,018 citations99
US9379078B2Jun 28, 2016
3D die stacking structure with fine pitches
TAIWAN SEMICONDUCTOR MFG86 citations98
US9087832B2Jul 21, 2015
Warpage reduction and adhesion improvement of semiconductor die package
TAIWAN SEMICONDUCTOR MFG54 citations98
US9035461B2May 19, 2015
Packaged semiconductor devices and packaging methods
TAIWAN SEMICONDUCTOR MFG19 citations92
US9070667B2Jun 30, 2015
Peripheral electrical connection of package on package
TAIWAN SEMICONDUCTOR MFG0 citations42
HU YEN-CHANG
3 patentsUS8922005B2Dec 30, 2014
Methods and apparatus for package on package devices with reversed stud bump through via interconnections
HU YEN-CHANG62 citations96
US8866285B2Oct 21, 2014
Fan-out package comprising bulk metal
HU YEN-CHANG1 citations51
US8816507B2Aug 26, 2014
Package-on-Package structures having buffer dams and method for forming the same
HU YEN-CHANG0 citations51