Inventor

LIN CHIA-SHENG

TW73 patents

⚠️ This page may combine multiple inventors who share the name “LIN CHIA-SHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN CHIA-SHENG

XINTEC INC

Electronic device package and fabrication method thereof

Sensing chip package and a manufacturing method thereof

Method for forming chip package

Chip package and fabrication method thereof

Chip package with substrate having first opening surrounded by second opening and method for forming the same

Chip package and method for forming the same

Chip package and manufacturing method thereof

Chip package including recess in side edge

Chip package

Semiconductor structure with sensor chip and landing pads

Wafer level array of chips and method thereof

Chip package and method for forming the same

Chip device packages and fabrication methods thereof

Method for forming chip package with second opening surrounding first opening having conductive structure therein

Manufacturing method of chip package and chip package

Manufacturing method of chip package and chip package

Manufacturing method of chip package and chip package

TAIWAN SEMICONDUCTOR MFG CO LTD

Strap-cell architecture for embedded memory

Control gate strap layout to improve a word line etch process window

Device-region layout for embedded flash

Control gate strap layout to improve a word line etch process window

ONON sidewall structure for memory device and method for making the same

Strap-cell architecture for embedded memory

Device-region layout for embedded flash

ONON sidewall structure for memory device and method for making the same

ONON sidewall structure for memory device and methods of making the same

Strap-cell architecture for embedded memory

Device-region layout for embedded flash

Strap-cell architecture for embedded memory

Shared pad/bridge layout for a 3D IC

LIN CHIA-SHENG

Chip package and fabrication method thereof

Cable tightening device having anti-theft function

Chip package and fabrication method thereof

Electronics device package and fabrication method thereof

Substrate structure with through vias

Chip package and fabrication method thereof

(unassigned)

Strap tightener with an auto-pulling device

Length adjustment mechanism of expandable rod

Device mounted on cargo carrier for holding securely cargo-locating rope

Quick-detachable device for attaching ropes thereto

Device used to hold a cargo-locating rope in a freight

LINTEX CO LTD

Connection lock

Lock

Connection lock

Locking head of wire

Engagement structure for a cable head

WISTRON CORP

Carrying structure for carrying electronic device

Support bracket

JIA HSIN PRESS CAST INDUSTRY C

Cable tension device having a tension adjustable function

LOU BAI-YAO

Chip package and method for forming the same