Inventor
PERRY CHARLES H
US33 patents
⚠️ This page may combine multiple inventors who share the name “PERRY CHARLES H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
32 patentsUS6528145B1Mar 4, 2003
Polymer and ceramic composite electronic substrates
IBM208 citations98
US5629631AMay 13, 1997
Interface card for a probe card assembly
IBM113 citations97
US5600257AFeb 4, 1997
Semiconductor wafer test and burn-in
IBM196 citations97
US6275051B1Aug 14, 2001
Segmented architecture for wafer test and burn-in
IBM127 citations96
US5532608AJul 2, 1996
Ceramic probe card and method for reducing leakage current
IBM72 citations96
US5130067AJul 14, 1992
Method and means for co-sintering ceramic/metal mlc substrates
IBM140 citations96
US5546012AAug 13, 1996
Probe card assembly having a ceramic probe card
IBM69 citations94
US5530371AJun 25, 1996
Probe card assembly
IBM83 citations94
US6486415B2Nov 26, 2002
Compliant layer for encapsulated columns
IBM20 citations92
US6458623B1Oct 1, 2002
Conductive adhesive interconnection with insulating polymer carrier
IBM45 citations92
US6404211B2Jun 11, 2002
Metal buckling beam probe
IBM41 citations92
US6333104B1Dec 25, 2001
Conductive polymer interconnection configurations
IBM21 citations92
US5260519ANov 9, 1993
Multilayer ceramic substrate with graded vias
IBM35 citations92
US4781970ANov 1, 1988
Strengthening a ceramic by post sinter coating with a compressive surface layer
IBM28 citations92
US5135595AAug 4, 1992
Process for fabricating a low dielectric composite substrate
IBM24 citations91
US6548175B2Apr 15, 2003
Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof
IBM48 citations90
US6529021B1Mar 4, 2003
Self-scrub buckling beam probe
IBM54 citations88
US6848914B2Feb 1, 2005
Electrical coupling of substrates by conductive buttons
IBM13 citations84
US5788808AAug 4, 1998
Apparatus for forming cavity substrates using compressive pads
IBM18 citations84
US5277725AJan 11, 1994
Process for fabricating a low dielectric composite substrate
IBM17 citations81
US5139852AAug 18, 1992
Low dielectric composite substrate
IBM21 citations80
US5293504AMar 8, 1994
Multilayer ceramic substrate with capped vias
IBM17 citations74
US6858111B2Feb 22, 2005
Conductive polymer interconnection configurations
IBM9 citations73
US5759320AJun 2, 1998
Method of forming cavity substrates using compressive pads
IBM12 citations73
US4937930AJul 3, 1990
Method for forming a defect-free surface on a porous ceramic substrate
IBM9 citations73
US4519851AMay 28, 1985
Method for providing pinhole free dielectric layers
IBM15 citations73
US6221269B1Apr 24, 2001
Method of etching molybdenum metal from substrates
IBM7 citations72
US6038931AMar 21, 2000
Method and apparatus for the testing of plastically deformable objects
IBM7 citations72
US4684339AAug 4, 1987
Gas-loaded pressure diaphragm
IBM3 citations63
US7278207B2Oct 9, 2007
Method of making an electronic package
IBM1 citations62
US6961995B2Nov 8, 2005
Method of making an electronic package
IBM3 citations62
US6227943B1May 8, 2001
Method and system for pre-cleaning and post-cleaning deposited metal
IBM3 citations62