Inventor
CHEN PING-TZU
TW12 patents
Patents
12 patentsUS11195818B2Dec 7, 2021
Backside contact for thermal displacement in a multi-wafer stacked integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US11756862B2Sep 12, 2023
Oversized via as through-substrate-via (TSV) stop layer
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11282769B2Mar 22, 2022
Oversized via as through-substrate-via (TSV) stop layer
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US12469817B2Nov 11, 2025
Support structure to reinforce stacked semiconductor wafers
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12300669B2May 13, 2025
Backside contact for thermal displacement in a multi-wafer stacked integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12205868B2Jan 21, 2025
Oversized via as through-substrate-via (TSV) stop layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11694997B2Jul 4, 2023
Backside contact for thermal displacement in a multi-wafer stacked integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12278151B2Apr 15, 2025
Semiconductor wafer seal ring having protrusion extending into trench in semiconductor substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12218106B2Feb 4, 2025
Backside contact to improve thermal dissipation away from semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11756936B2Sep 12, 2023
Backside contact to improve thermal dissipation away from semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11289455B2Mar 29, 2022
Backside contact to improve thermal dissipation away from semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12191282B2Jan 7, 2025
Shared pad/bridge layout for a 3D IC
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60