Inventor
TSENG CHIN-JEN
US14 patents
⚠️ This page may combine multiple inventors who share the name “TSENG CHIN-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
12 patentsUS11003884B2May 11, 2021
Fingerprint sensor device and methods thereof
QUALCOMM INC5 citations72
US11798307B2Oct 24, 2023
Under-display ultrasonic fingerprint sensors for foldable displays
QUALCOMM INC1 citations71
US11126814B2Sep 21, 2021
Ultrasonic fingerprint sensor with flexible substrate
QUALCOMM INC3 citations71
US10929636B2Feb 23, 2021
Ultrasonic fingerprint sensor with electrically nonconductive acoustic layer
QUALCOMM INC3 citations71
US12327426B2Jun 10, 2025
Ultrasonic fingerprint sensor for under-display applications
QUALCOMM INC0 citations60
US12217530B2Feb 4, 2025
Under-display ultrasonic fingerprint sensors for foldable displays
QUALCOMM INC0 citations60
US12169977B2Dec 17, 2024
Under-display ultrasonic fingerprint sensors for foldable displays
QUALCOMM INC0 citations60
US11910716B1Feb 20, 2024
Ultrasonic sensor system and multi-layer stiffener for foldable display
QUALCOMM INC0 citations59
US11087108B2Aug 10, 2021
Fingerprint sensor system including metamaterial
QUALCOMM INC0 citations59
US12183113B2Dec 31, 2024
Configuration of an ultrasonic fingerprint sensor relative to a display of a device
QUALCOMM INC0 citations51
US12553864B2Feb 17, 2026
Photoacoustic devices and systems including one or more light guide components
QUALCOMM INC0 citations47
US12471782B2Nov 18, 2025
Compact photoacoustic sensor
QUALCOMM INC0 citations45