Inventor

SU YAO-CHUN

TW17 patents

⚠️ This page may combine multiple inventors who share the name “SU YAO-CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SU YAO-CHUN

MEDIATEK INC

Semiconductor package with dummy MIM capacitor die

Semiconductor package with dummy MIM capacitor die

Signal count reduction between semiconductor dies assembled in wafer-level package

Supporting flow control mechanism of bus between semiconductor dies assembled in wafer-level package

Wafer-level package with at least one input/output port connected to at least one management bus

Electronic package with rotated semiconductor die

Electronic package with rotated semiconductor die

Electronic device for packing multiple commands in one compound command frame and electronic device for decoding and executing multiple commands packed in one compound command frame

Electronic package with rotated semiconductor die

Electronic device with enhanced management data input/output control

Multi-chip structure having flexible input/output chips

VIA TECH INC

Method for power management of central processor unit

Apparatus and related method of coordinating north bridge and south bridge for processing bus master requests of peripheral devices for controlling a central processing unit to operate in a power-saving state

Chip for use with both high-speed bus and low-speed bus and operation method thereof

HONG WEI-HSIANG

Method and system for request accessing and scheduling

VIA TECHNOLOGIES

Methods and systems for varying bus frequencies

SU YAO-CHUN

Apparatus and related method for maintaining read caching data of south bridge with north bridge