Inventor
KUO MENG-TSUNG
TW2 patents
Patents
2 patentsUS11978715B2May 7, 2024
Structure and formation method of chip package with protective lid
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations55
US12374600B2Jul 29, 2025
Dam structure on lid to constrain a thermal interface material in a semiconductor device package structure and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations44