Inventor

HATADA KENZO

JP32 patents

⚠️ This page may combine multiple inventors who share the name “HATADA KENZO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HATADA KENZO

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Stack type semiconductor package

Optical module having a vertical-cavity surface-emitting laser

Bump electrode for connecting electronic components

Method of connecting a semiconductor device to a wiring board

Electronic components mounting/connecting package and its fabrication method

Method of joining beam leads with projections to device electrodes

Method of bonding semiconductor devices together

Device for testing semiconductor integrated circuits and method of testing the same

Lighting apparatus with enhanced capability of removing heat

Lighting apparatus whose light emitting elements are hard to be taken off

Semiconductor device having a lead clamping arrangement

Semiconductor device and manufacturing method of the same

Bonding apparatus

Method for bonding lead with electrode of electronic device

Reduced diameter camera head for solid-state image pickup device and method of producing same

Lead connection structure

Method of connecting metal leads with electrodes of semiconductor device and metal lead therefore

Semiconductor device and method of producing said semiconductor device

Process for bonding a semiconductor to a circuit substrate including a solder bump transferring step

Semiconductor device and method of producing said semiconductor device

Apparatus for connecting semiconductor devices to wiring boards

Method of making metal electrode of semiconductor device

Bonding method

Method of connecting electrodes

Lead connection structure

Display panel assembly having a plurality of film carrier tapes on each of which a semiconductor divice is mounted

Electrode connection structure of flat device

Semiconductor device checking method

Time signal clock

Electronic clock having audible time indication

IBIDEN CO LTD

Semiconductor chip and method manufacturing the same

SHINDO COMPANY LTD

Semiconductor device