Inventor
DAVENPORT ROBERT E
US21 patents
⚠️ This page may combine multiple inventors who share the name “DAVENPORT ROBERT E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
20 patentsUS5803977ASep 8, 1998
Apparatus for full wafer deposition
APPLIED MATERIALS INC137 citations98
US9873180B2Jan 23, 2018
CMP pad construction with composite material properties using additive manufacturing processes
APPLIED MATERIALS INC41 citations97
US6103069AAug 15, 2000
Chamber design with isolation valve to preserve vacuum during maintenance
APPLIED MATERIALS INC56 citations96
US5735339AApr 7, 1998
Semiconductor processing apparatus for promoting heat transfer between isolated volumes
APPLIED MATERIALS INC37 citations96
US5460703AOct 24, 1995
Low thermal expansion clamping mechanism
APPLIED MATERIALS INC55 citations96
US10537974B2Jan 21, 2020
CMP pad construction with composite material properties using additive manufacturing processes
APPLIED MATERIALS INC17 citations94
US10384330B2Aug 20, 2019
Polishing pads produced by an additive manufacturing process
APPLIED MATERIALS INC22 citations93
US6450750B1Sep 17, 2002
Multiple loadlock system
APPLIED MATERIALS INC70 citations93
US6034000AMar 7, 2000
Multiple loadlock system
APPLIED MATERIALS INC71 citations93
US6222991B1Apr 24, 2001
Method for rotationally aligning and degassing semiconductor substrate within single vacuum chamber
APPLIED MATERIALS INC18 citations92
US5982986ANov 9, 1999
Apparatus and method for rotationally aligning and degassing semiconductor substrate within single vacuum chamber
APPLIED MATERIALS INC36 citations92
US5673167ASep 30, 1997
Support platen with removable insert useful in semiconductor processing apparatus
APPLIED MATERIALS INC26 citations92
US5511799AApr 30, 1996
Sealing device useful in semiconductor processing apparatus for bridging materials having a thermal expansion differential
APPLIED MATERIALS INC30 citations92
US6241477B1Jun 5, 2001
In-situ getter in process cavity of processing chamber
APPLIED MATERIALS INC34 citations91
US6506693B2Jan 14, 2003
Multiple loadlock system
APPLIED MATERIALS INC16 citations90
US10875145B2Dec 29, 2020
Polishing pads produced by an additive manufacturing process
APPLIED MATERIALS INC17 citations85
US10821573B2Nov 3, 2020
Polishing pads produced by an additive manufacturing process
APPLIED MATERIALS INC17 citations85
US6509069B1Jan 21, 2003
Method of reducing the cleaning requirements of a dielectric chuck surface
APPLIED MATERIALS INC5 citations74
US5507499AApr 16, 1996
Method of sealing useful in semiconductor processing apparatus for bridging materials having a thermal expansion differential
APPLIED MATERIALS INC10 citations74
US11958162B2Apr 16, 2024
CMP pad construction with composite material properties using additive manufacturing processes
APPLIED MATERIALS INC0 citations62