Inventor
OHBA KAORU
JP13 patents
⚠️ This page may combine multiple inventors who share the name “OHBA KAORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DOW GLOBAL TECHNOLOGIES LLC
9 patentsUS10487178B2Nov 26, 2019
DMPA-based solvent systems for the synthesis of poly (amic acid) and polyimide polymers
DOW GLOBAL TECHNOLOGIES LLC3 citations72
US10913058B2Feb 9, 2021
Purification process for hydrolysable organic solvent
DOW GLOBAL TECHNOLOGIES LLC2 citations66
US12521709B2Jan 13, 2026
Process for purifying organic solvents
DOW GLOBAL TECHNOLOGIES LLC0 citations62
US11581527B2Feb 14, 2023
Ethyl cellulose as a dispersant for lithium ion battery cathode production
DOW GLOBAL TECHNOLOGIES LLC1 citations62
US10982047B2Apr 20, 2021
Solvent systems for synthesis of poly(amic acid) and polyimide polymers
DOW GLOBAL TECHNOLOGIES LLC0 citations62
US11016392B2May 25, 2021
Amide combinations for cleaning and stripping of electronic parts
DOW GLOBAL TECHNOLOGIES LLC0 citations61
US11759774B2Sep 19, 2023
Purification process for hydrophilic organic solvent
DOW GLOBAL TECHNOLOGIES LLC0 citations56
US11349115B2May 31, 2022
Solvent systems for use in lithium ion battery production
DOW GLOBAL TECHNOLOGIES LLC0 citations51
US10731114B2Aug 4, 2020
Sulfoxide/glycol ether based solvents for use in the electronics industry
DOW GLOBAL TECHNOLOGIES LLC0 citations51
DOW CHEMICAL CO
3 patentsUS6420093B1Jul 16, 2002
Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards
DOW CHEMICAL CO18 citations89
US5223558AJun 29, 1993
Process for preparation of high-molecular-weight epoxy dimer acid ester resin
DOW CHEMICAL CO9 citations72
US5070174ADec 3, 1991
Polyamide epoxy ester resin, process for preparation thereof and coating composition
DOW CHEMICAL CO18 citations72