Inventor
CHOU JIN-TAU
TW3 patents
Patents
3 patentsUS6762466B2Jul 13, 2004
Circuit structure for connecting bonding pad and ESD protection circuit
UNITED MICROELECTRONICS CORP21 citations90
US6927457B2Aug 9, 2005
Circuit structure for connecting bonding pad and ESD protection circuit
UNITED MICROELECTRONICS CORP10 citations71
US6429082B1Aug 6, 2002
Method of manufacturing a high voltage using a latid process for forming a LDD
UNITED MICROELECTRONICS CORP4 citations60