P

Inventor

MA CHING-TIEN

TW10 patents
⚠️ This page may combine multiple inventors who share the name “MA CHING-TIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG

6 patents
US6764810B2Jul 20, 2004

Method for dual-damascene formation using a via plug

TAIWAN SEMICONDUCTOR MFG150 citations96
US6316351B1Nov 13, 2001

Inter-metal dielectric film composition for dual damascene process

TAIWAN SEMICONDUCTOR MFG43 citations90
US6570257B2May 27, 2003

IMD film composition for dual damascene process

TAIWAN SEMICONDUCTOR MFG6 citations71
US6830877B2Dec 14, 2004

Method for forming via and contact holes with deep UV photoresist

TAIWAN SEMICONDUCTOR MFG11 citations70
US6583062B1Jun 24, 2003

Method of improving an aspect ratio while avoiding etch stop

TAIWAN SEMICONDUCTOR MFG12 citations70
US6652666B2Nov 25, 2003

Wet dip method for photoresist and polymer stripping without buffer treatment step

TAIWAN SEMICONDUCTOR MFG4 citations56

SEMICONDUCTOR MFG INT SHANGHAI

3 patents
US7655554B2Feb 2, 2010

Method for eliminating loading effect using a via plug

SEMICONDUCTOR MFG INT SHANGHAI6 citations65
US7629673B2Dec 8, 2009

Contact etch stop film

SEMICONDUCTOR MFG INT SHANGHAI2 citations56
US7939915B2May 10, 2011

Contact etch stop film

SEMICONDUCTOR MFG INT SHANGHAI0 citations45

HUI WU XIANG

1 patent
US8089153B2Jan 3, 2012

Method for eliminating loading effect using a via plug

HUI WU XIANG2 citations47