Inventor
CHENG YAO-YI
TW11 patents
Patents
11 patentsUS6331480B1Dec 18, 2001
Method to improve adhesion between an overlying oxide hard mask and an underlying low dielectric constant material
TAIWAN SEMICONDUCTOR MFG95 citations98
US6159842ADec 12, 2000
Method for fabricating a hybrid low-dielectric-constant intermetal dielectric (IMD) layer with improved reliability for multilevel interconnections
TAIWAN SEMICONDUCTOR MFG97 citations97
US6187663B1Feb 13, 2001
Method of optimizing device performance via use of copper damascene structures, and HSQ/FSG, hybrid low dielectric constant materials
TAIWAN SEMICONDUCTOR MFG59 citations96
US6143670ANov 7, 2000
Method to improve adhesion between low dielectric constant layer and silicon containing dielectric layer
TAIWAN SEMICONDUCTOR MFG61 citations96
US6472335B1Oct 29, 2002
Methods of adhesion promoter between low-K layer and underlying insulating layer
TAIWAN SEMICONDUCTOR MFG28 citations92
US5795833AAug 18, 1998
Method for fabricating passivation layers over metal lines
TAIWAN SEMICONDUCTOR MFG43 citations92
US6242338B1Jun 5, 2001
Method of passivating a metal line prior to deposition of a fluorinated silica glass layer
TAIWAN SEMICONDUCTOR MFG18 citations84
US6255232B1Jul 3, 2001
Method for forming low dielectric constant spin-on-polymer (SOP) dielectric layer
TAIWAN SEMICONDUCTOR MFG12 citations74
US6020273AFeb 1, 2000
Method of stabilizing low dielectric constant films
TAIWAN SEMICONDUCTOR MFG9 citations71
US6706637B2Mar 16, 2004
Dual damascene aperture formation method absent intermediate etch stop layer
TAIWAN SEMICONDUCTOR MFG6 citations60
US6667249B1Dec 23, 2003
Minimizing coating defects in low dielectric constant films
TAIWAN SEMICONDUCTOR MFG0 citations51