Inventor
STOECKL STEPHAN
DE13 patents
⚠️ This page may combine multiple inventors who share the name “STOECKL STEPHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
7 patentsUS10403602B2Sep 3, 2019
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory
INTEL CORP2 citations72
US9368461B2Jun 14, 2016
Contact pads for integrated circuit packages
INTEL CORP4 citations72
US12057411B2Aug 6, 2024
Stress relief die implementation
INTEL CORP0 citations61
US12538797B2Jan 27, 2026
Substrate for improved heat dissipation and method
INTEL CORP0 citations60
US12564058B2Feb 24, 2026
Packaging architecture with reinforcement structure in package substrate
INTEL CORP0 citations58
US11374323B2Jun 28, 2022
Patch antennas stitched to systems in packages and methods of assembling same
INTEL CORP0 citations51
US12550736B2Feb 10, 2026
Packaging architecture with reinforcement structure in package substrate
INTEL CORP0 citations47
INFINEON TECHNOLOGIES AG
3 patentsUS6940156B2Sep 6, 2005
Electronic module with a semiconductor chip which has flexible chip contacts, and method for producing the electronic module
INFINEON TECHNOLOGIES AG8 citations72
US7709936B2May 4, 2010
Module with carrier element
INFINEON TECHNOLOGIES AG0 citations51
US7602614B2Oct 13, 2009
Electronic module and method for the production thereof
INFINEON TECHNOLOGIES AG0 citations49
INTEL IP CORP
3 patentsUS11018114B2May 25, 2021
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory
INTEL IP CORP0 citations61
US10141265B2Nov 27, 2018
Bent-bridge semiconductive apparatus
INTEL IP CORP0 citations51
US10727197B2Jul 28, 2020
Embedded-bridge substrate connectors and methods of assembling same
INTEL IP CORP0 citations40