Inventor

KU TZU-KUN

TW21 patents

⚠️ This page may combine multiple inventors who share the name “KU TZU-KUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KU TZU-KUN

IND TECH RES INST

Insitu formation of TiSi2/TiN bi-layer structures using self-aligned nitridation treatment on underlying CVD-TiSi2 layer

Insitu formation of TiSi2/TiN bi-layer structures using self-aligned nitridation treatment on underlying CVD-TiSi2 layer

Insitu formation of TiSi2 /TiN bi-layer structures using self-aligned nitridation treatment on underlying CVD-TiSi2 layer

Silicide glue layer for W-CVD plug application

CVD titanium silicide for contact hole plugs

Structures and manufacture method of electrochemical units

CVD titanium silicide for contract hole plugs

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

TSV substrate structure and the stacked assembly thereof

SILICON INTEGRATED SYS CORP

Method for forming a damascene structure

Method of forming shallow trench isolation with silicon oxynitride barrier film

Method of forming a metal-oxide semiconductor transistor

CENTRILLION TECH TAIWAN CO LTD

Microarray carrier assembly

Microarray and method for forming the same

Method for in-line measurement of quality of microarray

LIN CHA-HSIN

Semiconductor structure with conductive plug in an oxide layer

Method of fabricating oxide material layer with openings attached to device layers

NAT SCIENCE COUNCIL

Method of fabricating a field emission device

CHEN ERH-HAO

Method for manufacturing through substrate via (TSV), structure and control method of TSV capacitance

SILICON INTEGRATED SYSTEM CORP

Method of forming shallow trench isolation in a semiconductor substrate