Inventor
KUSHIHARA NAOYUKI
JP18 patents
Patents
18 patentsUS10793712B2Oct 6, 2020
Heat-curable resin composition for semiconductor encapsulation and semiconductor device
SHINETSU CHEMICAL CO2 citations71
US12565608B2Mar 3, 2026
Thermally conductive resin composition
SHINETSU CHEMICAL CO0 citations58
US12012485B2Jun 18, 2024
Heat-curable citraconimide resin composition
SHINETSU CHEMICAL CO1 citations58
US11984327B2May 14, 2024
Method for producing power module, and power module
SHINETSU CHEMICAL CO0 citations58
US12110356B2Oct 8, 2024
Heat-curable resin composition
SHINETSU CHEMICAL CO0 citations56
US12146057B2Nov 19, 2024
Cyclic imide resin composition, prepreg, copper-clad laminate and printed-wiring board
SHINETSU CHEMICAL CO0 citations51
US10865304B2Dec 15, 2020
Heat-curable resin composition, heat-curable resin film and semiconductor device
SHINETSU CHEMICAL CO0 citations51
US10850482B2Dec 1, 2020
Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device
SHINETSU CHEMICAL CO0 citations51
US10829589B2Nov 10, 2020
Heat-curable resin composition
SHINETSU CHEMICAL CO0 citations51
US10730273B2Aug 4, 2020
Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device
SHINETSU CHEMICAL CO0 citations51
US11059973B2Jul 13, 2021
Heat-curable resin composition and semiconductor device
SHINETSU CHEMICAL CO0 citations50
US11046848B2Jun 29, 2021
Heat-curable resin composition for semiconductor encapsulation and semiconductor device
SHINETSU CHEMICAL CO0 citations50
US9633921B2Apr 25, 2017
Semiconductor encapsulation resin composition and semiconductor device comprised of cured product of the semiconductor encapsulation resin composition
SHINETSU CHEMICAL CO1 citations50
US10385203B2Aug 20, 2019
Heat-curable resin composition for semiconductor encapsulation
SHINETSU CHEMICAL CO0 citations41
US10407536B2Sep 10, 2019
Heat-curable resin composition for semiconductor encapsulation
SHINETSU CHEMICAL CO0 citations40
US9972507B2May 15, 2018
Method for encapsulating large-area semiconductor element-mounted base material
SHINETSU CHEMICAL CO0 citations40
US9711378B2Jul 18, 2017
Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device
SHINETSU CHEMICAL CO0 citations40
US9382421B2Jul 5, 2016
Heat-curable resin composition
SHINETSU CHEMICAL CO0 citations40