Inventor
LIU PAI-CHOU
TW9 patents
Patents
9 patentsUS7180181B2Feb 20, 2007
Mesh shaped dam mounted on a substrate
ADVANCED SEMICONDUCTOR ENG17 citations82
US7365422B2Apr 29, 2008
Package of leadframe with heatsinks
ADVANCED SEMICONDUCTOR ENG8 citations65
US6088109AJul 11, 2000
System for detecting the presence of deposited metals on soldering points of an integrated circuit board substrate
ADVANCED SEMICONDUCTOR ENG6 citations60
US7911056B2Mar 22, 2011
Substrate structure having N-SMD ball pads
ADVANCED SEMICONDUCTOR ENG5 citations57
US7357294B2Apr 15, 2008
Method for mounting a semiconductor package onto PCB
ADVANCED SEMICONDUCTOR ENG4 citations55
US11791280B2Oct 17, 2023
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations54
US11107774B2Aug 31, 2021
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations54
US7728441B2Jun 1, 2010
Method for mounting a semiconductor package onto PCB
ADVANCED SEMICONDUCTOR ENG0 citations45
US7662709B2Feb 16, 2010
Surface mounting method
ADVANCED SEMICONDUCTOR ENG0 citations43