Inventor
HAN JA-HYUNG
KR10 patents
⚠️ This page may combine multiple inventors who share the name “HAN JA-HYUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
7 patentsUS6475914B2Nov 5, 2002
Method of manufacturing semiconductor device for protecting Cu layer from post chemical mechanical polishing-corrosion
SAMSUNG ELECTRONICS CO LTD26 citations91
US7488235B2Feb 10, 2009
Polishing apparatus and related polishing methods
SAMSUNG ELECTRONICS CO LTD17 citations90
US7066785B2Jun 27, 2006
Polishing apparatus and related polishing methods
SAMSUNG ELECTRONICS CO LTD21 citations90
US6596581B2Jul 22, 2003
Method for manufacturing a semiconductor device having a metal-insulator-metal capacitor and a damascene wiring layer structure
SAMSUNG ELECTRONICS CO LTD26 citations89
US7214123B2May 8, 2007
Retainer ring, Polishing head, and chemical mechanical polishing apparatus
SAMSUNG ELECTRONICS CO LTD13 citations82
US6924234B2Aug 2, 2005
Method and apparatus for polishing a copper layer and method for forming a wiring structure using copper
SAMSUNG ELECTRONICS CO LTD6 citations61
US6913972B2Jul 5, 2005
Method of fabrication on a gate pattern of a non-volatile memory device
SAMSUNG ELECTRONICS CO LTD1 citations47
GLOBALFOUNDRIES INC
3 patentsUS9123771B2Sep 1, 2015
Shallow trench isolation integration methods and devices formed thereby
GLOBALFOUNDRIES INC13 citations82
US9385192B2Jul 5, 2016
Shallow trench isolation integration methods and devices formed thereby
GLOBALFOUNDRIES INC3 citations71
US10056458B2Aug 21, 2018
Siloxane and organic-based MOL contact patterning
GLOBALFOUNDRIES INC0 citations39