Inventor

ARATA MICHITOSHI

JP9 patents

Patents

9 patents

US6696155B1Feb 24, 2004

Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substances

HITACHI CHEMICAL CO LTD34 citations92

US7208539B2Apr 24, 2007

Thermosetting resin composition, and prepreg and laminated board using the same

HITACHI CHEMICAL CO LTD15 citations83

US6558797B1May 6, 2003

Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same

HITACHI CHEMICAL CO LTD16 citations83

US6572968B2Jun 3, 2003

Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boards

HITACHI CHEMICAL CO LTD11 citations73

US6462147B1Oct 8, 2002

Epoxy resin compositions for printed circuit board and printed circuit board using the same

HITACHI CHEMICAL CO LTD10 citations73

US6329474B1Dec 11, 2001

Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formaldehyde condensate and masked imidazole

HITACHI CHEMICAL CO LTD10 citations73

US6214468B1Apr 10, 2001

Flame retardant epoxy resin composition for printed board, and prepreg and metal foil clad laminate using the same

HITACHI CHEMICAL CO LTD7 citations73

US6180250B1Jan 30, 2001

Epoxy composition for printed circuit boards

HITACHI CHEMICAL CO LTD5 citations62

US6692792B2Feb 17, 2004

Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances

HITACHI CHEMICAL CO LTD0 citations51