Inventor

LEE CHUNG-SUN

KR20 patents

⚠️ This page may combine multiple inventors who share the name “LEE CHUNG-SUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE CHUNG-SUN

SAMSUNG ELECTRONICS CO LTD

Semiconductor chip stack having improved encapsulation

Camera module and electronic apparatus having the same

Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same

Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same

Image sensor package, method of manufacturing the same, and image sensor module including the image sensor package

Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device

Stack type semiconductor chip package having different type of chips and fabrication method thereof

Method for manufacturing tape wiring board

Tape circuit substrate and semiconductor chip package using the same

Method for manufacturing semiconductor package having redistribution layer

Method for manufacturing tape wiring board

Circuit film with bump, film package using the same, and related fabrication methods

Wafer-level-chip-scale package and method of fabrication

Light emitting diode display device

Semiconductor device and method for manufacturing the same

LEE CHUNG-SUN

Semiconductor device including a stack of semiconductor chips, underfill material and molding material

Stack package and semiconductor package including the same

KWON WOON-SEONG

Camera modules and methods of fabricating the same

LEE HYUEK-JAE

Image sensor having through via

CHOI KYOUNG-SEI

Method for manufacturing tape wiring board