Inventor
YANG CHUNG CHING
US13 patents
⚠️ This page may combine multiple inventors who share the name “YANG CHUNG CHING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
9 patentsUS6930368B2Aug 16, 2005
MEMS having a three-wafer structure
HEWLETT PACKARD DEVELOPMENT CO33 citations92
US6537846B2Mar 25, 2003
Substrate bonding using a selenidation reaction
HEWLETT PACKARD DEVELOPMENT CO26 citations92
US6590850B2Jul 8, 2003
Packaging for storage devices using electron emissions
HEWLETT PACKARD DEVELOPMENT CO37 citations89
US6664193B2Dec 16, 2003
Device isolation process flow for ARS system
HEWLETT PACKARD DEVELOPMENT CO5 citations73
US8003980B2Aug 23, 2011
Layered electro-organic devices with crosslinked polymer and methods of preparing the same
HEWLETT PACKARD DEVELOPMENT CO2 citations62
US7185973B2Mar 6, 2007
Assembly for material deposition
HEWLETT PACKARD DEVELOPMENT CO4 citations62
US6980507B2Dec 27, 2005
Luminescence-phase change based data storage
HEWLETT PACKARD DEVELOPMENT CO2 citations62
US7496216B2Feb 24, 2009
Fingerprint capture
HEWLETT PACKARD DEVELOPMENT CO4 citations61
US6900468B2May 31, 2005
Indium chalcogenide, gallium chalcogenide, and indium-gallium chalcogenide phase-change media for ultra-high-density data-storage devices
HEWLETT PACKARD DEVELOPMENT CO3 citations55
HEWLETT PACKARD CO
2 patentsUS6440820B1Aug 27, 2002
Process flow for ARS mover using selenidation wafer bonding after processing a media side of a rotor wafer
HEWLETT PACKARD CO16 citations83
US6436794B1Aug 20, 2002
Process flow for ARS mover using selenidation wafer bonding before processing a media side of a rotor wafer
HEWLETT PACKARD CO18 citations83