Inventor

DUBEY MANISH

US22 patents

⚠️ This page may combine multiple inventors who share the name “DUBEY MANISH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DUBEY MANISH

INTEL CORP

Microelectronic component having molded regions with through-mold vias

Microelectronic component having molded regions with through-mold vias

Microelectronic component having molded regions with through-mold vias

Electronic package that includes multi-layer stiffener

Foam composite

Electronic package with corner supports

Electronic package and method of connecting a first die to a second die to form an electronic package

Open cavity bridge co-planar placement architectures and processes

Microelectronic component having molded regions with through-mold vias

Thermal management solutions for integrated circuit packages

Integrated heat spreader (IHS) with heating element

Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnects

Method for reducing underfill filler settling in integrated circuit packages

Microelectronic structures including bridges

Channeled lids for integrated circuit packages

Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures

Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures

Gradient encapsulant protection of devices in stretchable electronics

Microelectronic die having chamfered corners

LINKEDIN CORP

Product deployment system

Product deployment system

Request change tracker