Inventor
NARDI PATRICK
US9 patents
Patents
9 patentsUS9418912B2Aug 16, 2016
Methods of forming serpentine thermal interface material and structures formed thereby
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US10535615B2Jan 14, 2020
Electronic package that includes multi-layer stiffener
INTEL CORP2 citations72
US9832860B2Nov 28, 2017
Panel level fabrication of package substrates with integrated stiffeners
INTEL CORP4 citations72
US10651108B2May 12, 2020
Foam composite
INTEL CORP4 citations71
US9887104B2Feb 6, 2018
Electronic package and method of connecting a first die to a second die to form an electronic package
INTEL CORP2 citations67
US10290569B2May 14, 2019
Constrained cure component attach process for improved IC package warpage control
INTEL CORP2 citations64
US12494441B2Dec 9, 2025
BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling load
INTEL CORP0 citations59
US12183688B2Dec 31, 2024
Integrated circuit die package stiffeners of metal alloys having exceptionally high CTE
INTEL CORP0 citations54
US9230877B2Jan 5, 2016
Methods of forming serpentine thermal interface material and structures formed thereby
INTEL CORP1 citations48