Inventor
PARK HWANPIL
KR8 patents
Patents
8 patentsUS10847435B2Nov 24, 2020
Semiconductor package structure and fabrication method thereof
SAMSUNG ELECTRONICS CO LTD9 citations82
US12033924B2Jul 9, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US12261093B2Mar 25, 2025
Semiconductor packages having a dam structure
SAMSUNG ELECTRONICS CO LTD0 citations61
US12136581B2Nov 5, 2024
Semiconductor package structure and fabrication method thereof
SAMSUNG ELECTRONICS CO LTD0 citations61
US11842941B2Dec 12, 2023
Semiconductor package structure and fabrication method thereof
SAMSUNG ELECTRONICS CO LTD0 citations61
US11776913B2Oct 3, 2023
Semiconductor package and a package-on-package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11437293B2Sep 6, 2022
Semiconductor packages having a dam structure
SAMSUNG ELECTRONICS CO LTD0 citations61
US11315851B2Apr 26, 2022
Semiconductor package structure and fabrication method thereof
SAMSUNG ELECTRONICS CO LTD0 citations61