Inventor

HSU YI-FENG

TW3 patents

Patents

3 patents

US9502366B2Nov 22, 2016

Semiconductor structure with UBM layer and method of fabricating the same

UNITED MICROELECTRONICS CORP3 citations68

US12543585B2Feb 3, 2026

Semiconductor structure and manufacturing method thereof

UNITED MICROELECTRONICS CORP0 citations53

US12525566B2Jan 13, 2026

Semiconductor package and fabrication method thereof

UNITED MICROELECTRONICS CORP0 citations46