P

Inventor

WATKINS CHARLES M

US115 patents
⚠️ This page may combine multiple inventors who share the name “WATKINS CHARLES M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

42 patents
US7091124B2Aug 15, 2006

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

MICRON TECHNOLOGY INC114 citations99
US6906418B2Jun 14, 2005

Semiconductor component having encapsulated, bonded, interconnect contacts

MICRON TECHNOLOGY INC140 citations99
US7759800B2Jul 20, 2010

Microelectronics devices, having vias, and packaged microelectronic devices having vias

MICRON TECHNOLOGY INC51 citations98
US7683458B2Mar 23, 2010

Through-wafer interconnects for photoimager and memory wafers

MICRON TECHNOLOGY INC54 citations98
US7157310B2Jan 2, 2007

Methods for packaging microfeature devices and microfeature devices formed by such methods

MICRON TECHNOLOGY INC99 citations98
US6803303B1Oct 12, 2004

Method of fabricating semiconductor component having encapsulated, bonded, interconnect contacts

MICRON TECHNOLOGY INC80 citations98
US6127777AOct 3, 2000

Field emission display with non-evaporable getter material

MICRON TECHNOLOGY INC60 citations96
US6054808AApr 25, 2000

Display device with grille having getter material

MICRON TECHNOLOGY INC59 citations96
US5827102AOct 27, 1998

Low temperature method for evacuating and sealing field emission displays

MICRON TECHNOLOGY INC77 citations96
US5795206AAug 18, 1998

Fiber spacers in large area vacuum displays and method for manufacture of same

MICRON TECHNOLOGY INC34 citations96
US7629250B2Dec 8, 2009

Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies

MICRON TECHNOLOGY INC16 citations93
US7598167B2Oct 6, 2009

Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures

MICRON TECHNOLOGY INC20 citations93
US7413979B2Aug 19, 2008

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

MICRON TECHNOLOGY INC16 citations93
US7199439B2Apr 3, 2007

Microelectronic imagers and methods of packaging microelectronic imagers

MICRON TECHNOLOGY INC24 citations93
US7189954B2Mar 13, 2007

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

MICRON TECHNOLOGY INC13 citations93
US7115961B2Oct 3, 2006

Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices

MICRON TECHNOLOGY INC33 citations93
US7094117B2Aug 22, 2006

Electrical contacts with dielectric cores

MICRON TECHNOLOGY INC19 citations93
US7030632B2Apr 18, 2006

Compliant contract structures, contactor cards and test system including same

MICRON TECHNOLOGY INC13 citations93
US6255769B1Jul 3, 2001

Field emission displays with raised conductive features at bonding locations and methods of forming the raised conductive features

MICRON TECHNOLOGY INC20 citations93
US6036567AMar 14, 2000

Process for aligning and sealing components in a display device

MICRON TECHNOLOGY INC26 citations93
US5931713AAug 3, 1999

Display device with grille having getter material

MICRON TECHNOLOGY INC26 citations93
US5906771AMay 25, 1999

Manufacturing process for high-purity phosphors having utility in field emission displays

MICRON TECHNOLOGY INC20 citations93
US5788881AAug 4, 1998

Visible light-emitting phosphor composition having an enhanced luminescent efficiency over a broad range of voltages

MICRON TECHNOLOGY INC30 citations93
US8384105B2Feb 26, 2013

Light emitting diodes with enhanced thermal sinking and associated methods of operation

MICRON TECHNOLOGY INC23 citations92
US7956443B2Jun 7, 2011

Through-wafer interconnects for photoimager and memory wafers

MICRON TECHNOLOGY INC16 citations92
US6509677B2Jan 21, 2003

Focusing electrode and method for field emission displays

MICRON TECHNOLOGY INC30 citations92
US6400075B2Jun 4, 2002

Faceplate for field emission display

MICRON TECHNOLOGY INC16 citations92
US5785569AJul 28, 1998

Method for manufacturing hollow spacers

MICRON TECHNOLOGY INC23 citations92
US11239403B2Feb 1, 2022

Light emitting diodes with enhanced thermal sinking and associated methods of operation

MICRON TECHNOLOGY INC4 citations84
US10403805B2Sep 3, 2019

Light emitting diodes with enhanced thermal sinking and associated methods of operation

MICRON TECHNOLOGY INC4 citations84
US9748461B2Aug 29, 2017

Light emitting diodes with enhanced thermal sinking and associated methods of operation

MICRON TECHNOLOGY INC8 citations84
US9236550B2Jan 12, 2016

Light emitting diodes with enhanced thermal sinking and associated methods of operation

MICRON TECHNOLOGY INC7 citations84
US8669179B2Mar 11, 2014

Through-wafer interconnects for photoimager and memory wafers

MICRON TECHNOLOGY INC5 citations84
US7575999B2Aug 18, 2009

Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies

MICRON TECHNOLOGY INC9 citations84
US7419841B2Sep 2, 2008

Microelectronic imagers and methods of packaging microelectronic imagers

MICRON TECHNOLOGY INC10 citations84
US7341881B2Mar 11, 2008

Methods of packaging and testing microelectronic imaging devices

MICRON TECHNOLOGY INC9 citations84
US7148715B2Dec 12, 2006

Systems and methods for testing microelectronic imagers and microfeature devices

MICRON TECHNOLOGY INC12 citations84
US6183329B1Feb 6, 2001

Fiber spacers in large area vacuum displays and method for manufacture of same

MICRON TECHNOLOGY INC14 citations81
US7855140B2Dec 21, 2010

Method of forming vias in semiconductor substrates and resulting structures

MICRON TECHNOLOGY INC6 citations74
US7488618B2Feb 10, 2009

Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same

MICRON TECHNOLOGY INC6 citations74
US7442643B2Oct 28, 2008

Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials

MICRON TECHNOLOGY INC5 citations74
US7294897B2Nov 13, 2007

Packaged microelectronic imagers and methods of packaging microelectronic imagers

MICRON TECHNOLOGY INC9 citations74

MICRON DISPLAY TECH INC

5 patents

AKRAM SALMAN

1 patent

ROUND ROCK RES LLC

1 patent

WATKINS CHARLES M

1 patent

Showing the top 50 of 115 patents by PatentIndex Score.