Inventor

JUN CHUNG-SAM

KR73 patents

⚠️ This page may combine multiple inventors who share the name “JUN CHUNG-SAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JUN CHUNG-SAM

SAMSUNG ELECTRONICS CO LTD

Method of monitoring contact hole of integrated circuit using corona charges

Wafer inspection system and method for selectively inspecting conductive pattern defects

Method of and device for detecting micro-scratches

Method of and device for detecting micro-scratches

Apparatus and method for contact failure inspection in semiconductor devices

Method of inspecting a substrate using ultrasonic waves and apparatus for performing the same

Method of inspecting a leakage current characteristic of a dielectric layer and apparatus for performing the method

Image creating method and imaging system for performing the same

Method of forming a three-dimensional image of a pattern to be inspected and apparatus for performing the same

Scanning electron microscope system capable of measuring in-cell overlay offset using high-energy electron beam and method thereof

Broadband light source and optical inspector having the same

Spectral ellipsometry measurement and data analysis device and related systems and methods

Method and apparatus for detecting thickness of thin layer formed on a wafer

Method of inspecting surface and method of manufacturing semiconductor device

Method for inspecting a polishing pad in a semiconductor manufacturing process, an apparatus for performing the method, and a polishing device adopting the apparatus

Method of inspecting wafer using electron beam

Method of detecting defects of patterns on a semiconductor substrate and apparatus for performing the same

Method of analyzing a wafer sample

Method and apparatus for inspecting target defects on a wafer

Method and apparatus for inspecting a substrate

Method of inspecting pattern defect

Method and apparatus for inspecting defects in multiple regions with different parameters

Method and apparatus for classifying defects of an object

Method and apparatus for inspecting a wafer surface

Method and apparatus for inspecting defects

Method of measuring and controlling concentration of dopants of a thin film

Method of measuring a concentration of a material and method of measuring a concentration of a dopant of a semiconductor device

Method of inspecting surface and method of manufacturing semiconductor device

Optical inspection tool having lens unit with multiple beam paths for detecting surface defects of a substrate and methods of using same

Apparatus and method for inspecting a surface of a wafer

Method of classifying defects

Apparatus and method for inspecting a substrate

Method and apparatus for inspecting an edge exposure area of a wafer

Systems and methods for measuring distance of semiconductor patterns

Method for inspection of defects on a substrate

Method of inspecting for defects and apparatus for performing the method

Method and apparatus for inspecting substrate pattern

Method and apparatus for measuring thickness of metal layer

Wafer color variation correcting method, selective wafer defect detecting method, and computer readable recording media for the same

Method and apparatus for measuring contamination of a semiconductor substrate

Defect inspection method and defect inspection apparatus

Method and apparatus for inspecting a substrate

Wafer holder and wafer conveyor system equipped with the same

Method and apparatus for obtaining an image using a selective combination of wavelengths of light

Method for measuring step difference in a semiconductor device and apparatus for performing the same

Method for monitoring an ion implanter and ion implanter having a shadow jig for performing the same

Conductive atomic force microscope and method of operating the same

YANG YU-SIN

Method of detecting defects in patterns on semiconductor substrate by comparing second image with reference image after acquiring second image from first image and apparatus for performing the same

YUN SEONG-JIN

Overlay measuring method and system, and method of manufacturing semiconductor device using the same

SAMSUNG ELECTRIC

Method and apparatus for detecting contaminants in ion-implanted wafer