Inventor
CHON SANG-MUN
KR41 patents
⚠️ This page may combine multiple inventors who share the name “CHON SANG-MUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
40 patentsUS6706646B1Mar 16, 2004
Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same
SAMSUNG ELECTRONICS CO LTD40 citations92
US6440760B1Aug 27, 2002
Method of measuring etched state of semiconductor wafer using optical impedence measurement
SAMSUNG ELECTRONICS CO LTD67 citations92
US6528333B1Mar 4, 2003
Method of and device for detecting micro-scratches
SAMSUNG ELECTRONICS CO LTD28 citations91
US6508887B1Jan 21, 2003
Resist removing composition and resist removing method using the same
SAMSUNG ELECTRONICS CO LTD38 citations91
US6449037B2Sep 10, 2002
Method of and device for detecting micro-scratches
SAMSUNG ELECTRONICS CO LTD19 citations91
US5846921ADec 8, 1998
Semiconductor substrate cleaning solutions, methods of forming the same, and methods using the same
SAMSUNG ELECTRONICS CO LTD26 citations89
US7605094B2Oct 20, 2009
Method of forming metal oxide using an atomic layer deposition process
SAMSUNG ELECTRONICS CO LTD8 citations84
US7179537B2Feb 20, 2007
Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same
SAMSUNG ELECTRONICS CO LTD11 citations84
US7311857B2Dec 25, 2007
Etching composition, method of preparing the same, method of etching an oxide film, and method of manufacturing a semiconductor device
SAMSUNG ELECTRONICS CO LTD13 citations81
US6816029B2Nov 9, 2004
RF matching unit
SAMSUNG ELECTRONICS CO LTD9 citations73
US6398874B2Jun 4, 2002
Use of alkoxy N-hydroxyalkyl alkanamide as resist removing agent, composition for removing resist, method for preparing the same and resist removing method using the same
SAMSUNG ELECTRONICS CO LTD11 citations73
US6274537B1Aug 14, 2001
Use of alkoxy N-hydroxyalkyl alkanamide as resist removing agent, composition for removing resist, method for preparing the same and resist removing method using the same
SAMSUNG ELECTRONICS CO LTD11 citations73
US6655042B2Dec 2, 2003
System and method for drying semiconductor substrate
SAMSUNG ELECTRONICS CO LTD12 citations72
US6515293B1Feb 4, 2003
Method and apparatus for detecting thickness of thin layer formed on a wafer
SAMSUNG ELECTRONICS CO LTD9 citations72
US7183192B2Feb 27, 2007
Composition for removing photoresist and method of forming a bump electrode in a semiconductor device using the composition
SAMSUNG ELECTRONICS CO LTD7 citations71
US6589719B1Jul 8, 2003
Photoresist stripper compositions
SAMSUNG ELECTRONICS CO LTD10 citations71
US6165841ADec 26, 2000
Method for fabricating capacitors with hemispherical grains
SAMSUNG ELECTRONICS CO LTD15 citations70
US7258931B2Aug 21, 2007
Semiconductor wafers having asymmetric edge profiles that facilitate high yield processing by inhibiting particulate contamination
SAMSUNG ELECTRONICS CO LTD7 citations69
US6682876B2Jan 27, 2004
Thinner composition and method of stripping a photoresist using the same
SAMSUNG ELECTRONICS CO LTD7 citations69
US7250379B2Jul 31, 2007
Method of forming metal oxide using an atomic layer deposition process
SAMSUNG ELECTRONICS CO LTD5 citations63
US7113274B2Sep 26, 2006
Method and apparatus for inspecting a substrate
SAMSUNG ELECTRONICS CO LTD2 citations63
US7433032B2Oct 7, 2008
Method and apparatus for inspecting defects in multiple regions with different parameters
SAMSUNG ELECTRONICS CO LTD2 citations62
US7387988B2Jun 17, 2008
Thinner composition and method of removing photoresist using the same
SAMSUNG ELECTRONICS CO LTD4 citations62
US7310140B2Dec 18, 2007
Method and apparatus for inspecting a wafer surface
SAMSUNG ELECTRONICS CO LTD2 citations62
US7271890B2Sep 18, 2007
Method and apparatus for inspecting defects
SAMSUNG ELECTRONICS CO LTD2 citations62
US6713440B2Mar 30, 2004
Resist and etching by-product removing composition and resist removing method using the same
SAMSUNG ELECTRONICS CO LTD3 citations61
US7385689B2Jun 10, 2008
Method and apparatus for inspecting substrate pattern
SAMSUNG ELECTRONICS CO LTD5 citations60
US7027638B2Apr 11, 2006
Wafer color variation correcting method, selective wafer defect detecting method, and computer readable recording media for the same
SAMSUNG ELECTRONICS CO LTD4 citations60
US6927077B2Aug 9, 2005
Method and apparatus for measuring contamination of a semiconductor substrate
SAMSUNG ELECTRONICS CO LTD4 citations60
US6503682B1Jan 7, 2003
Photoresist composition, preparation method thereof and method for forming a pattern during semiconductor processing using the photoresist composition
SAMSUNG ELECTRONICS CO LTD4 citations60
US7642200B2Jan 5, 2010
Methods of forming a thin film and methods of manufacturing a capacitor and a gate structure using the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7573568B2Aug 11, 2009
Method and apparatus for detecting a photolithography processing error, and method and apparatus for monitoring a photolithography process
SAMSUNG ELECTRONICS CO LTD1 citations52
US7863231B2Jan 4, 2011
Thinner composition and method of removing photoresist using the same
SAMSUNG ELECTRONICS CO LTD1 citations51
US7223721B2May 29, 2007
Resist and etching by-product removing composition and resist removing method using the same
SAMSUNG ELECTRONICS CO LTD1 citations51
US6870948B2Mar 22, 2005
Method and apparatus for numerically analyzing grain growth on semiconductor wafer using SEM image
SAMSUNG ELECTRONICS CO LTD1 citations51
US6590378B2Jul 8, 2003
Real time parameter monitoring apparatus for high voltage chamber in semiconductor wafer processing system
SAMSUNG ELECTRONICS CO LTD1 citations51
US6137018AOct 24, 2000
Chemical refining method and reuse system for semiconductor device manufacturing
SAMSUNG ELECTRONICS CO LTD1 citations51
US7858527B2Dec 28, 2010
Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition
SAMSUNG ELECTRONICS CO LTD0 citations49
US7288212B2Oct 30, 2007
Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition
SAMSUNG ELECTRONICS CO LTD1 citations49
US7678751B2Mar 16, 2010
Composition for removing photoresist, method of removing photoresist and method of manufacturing a semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD1 citations48