Inventor
PRABHU ASHOK NARAYAN
US23 patents
⚠️ This page may combine multiple inventors who share the name “PRABHU ASHOK NARAYAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SARNOFF CORP
18 patentsUS6055151AApr 25, 2000
Multilayer ceramic circuit boards including embedded components
SARNOFF CORP70 citations95
US5847935ADec 8, 1998
Electronic circuit chip package
SARNOFF CORP63 citations95
US5880705AMar 9, 1999
Mounting structure for a tessellated electronic display having a multilayer ceramic structure and tessellated electronic display
SARNOFF CORP73 citations93
US6017642AJan 25, 2000
Low dielectric loss glasses
SARNOFF CORP32 citations92
US6011330AJan 4, 2000
Miniature power supply
SARNOFF CORP34 citations92
US5958807ASep 28, 1999
Low dielectric loss glass ceramic compositions
SARNOFF CORP34 citations92
US5953203ASep 14, 1999
Multilayer ceramic circuit boards including embedded capacitors
SARNOFF CORP50 citations92
US5876536AMar 2, 1999
Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrate
SARNOFF CORP20 citations92
US5866240AFeb 2, 1999
Thick ceramic on metal multilayer circuit board
SARNOFF CORP48 citations92
US5858145AJan 12, 1999
Method to control cavity dimensions of fired multilayer circuit boards on a support
SARNOFF CORP64 citations92
US6140767AOct 31, 2000
Plasma display having specific substrate and barrier ribs
SARNOFF CORP17 citations91
US6361390B1Mar 26, 2002
Method for making an embossed plasma display back panel
SARNOFF CORP18 citations90
US6140759AOct 31, 2000
Embossed plasma display back panel
SARNOFF CORP35 citations90
US6399230B1Jun 4, 2002
Multilayer ceramic circuit boards with embedded resistors
SARNOFF CORP50 citations89
US6321569B1Nov 27, 2001
Method for forming back panel for a plasma display device
SARNOFF CORP14 citations72
US6168490B1Jan 2, 2001
Back panel for a plasma display device
SARNOFF CORP9 citations72
US6471805B1Oct 29, 2002
Method of forming metal contact pads on a metal support substrate
SARNOFF CORP4 citations63
US6286204B1Sep 11, 2001
Method for fabricating double sided ceramic circuit boards using a titanium support substrate
SARNOFF CORP3 citations61
LAMINA CERAMICS INC
2 patentsUS6455930B1Sep 24, 2002
Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology
LAMINA CERAMICS INC126 citations97
US6709749B1Mar 23, 2004
Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrate
LAMINA CERAMICS INC10 citations73